ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,000, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Non-volatile memory device including first a... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,001, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-Si, South Korea). "Display device including display panel and info... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,002, issued on April 7, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Substrate-integrated waveguide" was invented by Yiqi Tang (Allen,... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,003, issued on April 7, was assigned to AaltoSemi Inc. (Nanjing City, China). "Manufacturing method of package substrate" was invented by A... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,004, issued on April 7, was assigned to NXP USA INC. (Austin, Texas). "Semiconductor device with active mold package and method therefor" w... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,005, issued on April 7, was assigned to ZF Friedrichshafen AG (Friedrichshafen, Germany). "Power electronics module" was invented by Ake Ew... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,006, issued on April 7, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Electronic device" was invented by Yuji Ishimatsu (Kyoto, Japan), Ke... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,007, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Composite IC die package including an electro-thermo-mechanical... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,008, issued on April 7, was assigned to NXP USA INC. (Austin, Texas). "Transistor with source manifold in non-active die region" was invent... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,009, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure" was invented by ... और पढ़ें